Thermal conductive modified materials are based on general/engineering plastics, filled with boron nitride, aluminum oxide, magnesium oxide, graphite, carbon fiber, and other thermal conductive materials
The core substrate of the filler includes thermal conductive PA (PA6/PA66), thermal conductive PPA, thermal conductive PC, thermal conductive PBT/PET, and thermal conductive PPS
And graphite/carbon fiber composite thermal conductive modified material.
1、 Thermal conductivity PA series
Features:
Modification of fillers such as graphite and boron nitride, isotropic thermal conductivity, balancing toughness and mechanical strength; The insulation/non-conductive formula can be customized,
Fatigue resistance, impact resistance, controllable water absorption, good injection flowability, and easy mass production.
Core advantages:
Outstanding cost-effectiveness, short molding cycle, suitable for mass production of structural components; Moderate temperature resistance, not easily deformed, resistant to aging, and significantly lightweight,
Can replace metal and aluminum materials, reducing costs and weight.
Application fields:
Universal cooling fan casing and blades; Ordinary lamp heat dissipation base, small and medium-sized LED lighting heat sink; Lightweight small household appliances
Thermal structural components; Small household appliances (hair dryer, curling iron) heating element thermal insulation and conduction bracket; Kitchen and bathroom appliances (range hood, water heater)
Electronic control module heat dissipation base.