Features:
The directional thermal conductivity and in-plane thermal conductivity have outstanding efficiency, combining thermal conductivity, rigidity, and lightweight; Customizable high thermal conductivity and electromagnetic shielding composite
Suitable for high-end precision scenarios with high performance.
Core advantages:
The heat dissipation efficiency is close to that of lightweight metals, with significant weight reduction effect. The structure is reinforced and not easily brittle, which can replace high-end metal heat dissipation components
Considering performance and lightweight.
Application fields:
High end gaming graphics card cooling base, ultra-thin computing power device cooling bracket; High end silent fan, high-performance radiator structural components; pen
Computer CPU/GPU auxiliary heat dissipation bracket, thermal conduction frame of the body; 5G base station antenna heat dissipation plastic parts, communication power supply conductors
Hot shell; High end medical diagnostic and therapeutic equipment power supply heat dissipation components.